[ecoop-info] CFP: SPLC 2007

[Thorsten Weyer]

We kindly apologize for multiple postings 

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 	C A L L   F O R    P A P E R S   
   
	11th International 
	Software Product Line Conference 
                   
    	S P L C   2 0 0 7

     	Kyoto (Japan), 10 - 14 September 2007  
   	http://sec.ipa.go.jp/SPLC2007/
 
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 Submission Deadlines:   
  
 Paper submission (firm!)                Feb 28, 2007   
 Author notification                     Apr 19, 2007  
 Camera ready paper deadline (firm!)     Apr 30, 2007   
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 With SPLC 2007, *the* premier forum for practitioners,   
 researchers and educators to present and discuss the   
 most recent ideas, innovations, trends, experiences,  
 and concerns in the area software product lines and  
 software product family engineering comes to Asia for 
 the first time .   
 The objective is to continue the dialogue between software 
 product line practitioners and researchers on the benefits, 
 obstacles, and weaknesses of applying software product line  
 principles, techniques, methods, processes, and tools in  
 an industrial or organizational setting. 
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 Scope: 

 Topics of interest of SPLC 2007 include, but are definitely 
 not restricted to:
 * Industrial experiences in product line engineering 
 * Techniques and tools for product line engineering 
 * Evolution of product line assets 
 * Business issues for product lines 
 * Organizational and process issues for product lines 
 * Product line life-cycle issues 

 We invite three classes of original, unpublished  
 submissions:   
 (1) RESEARCH PAPERS describe original research 
     contribution (theoretical, conceptual) to the field 
     of software product line engineering. A research paper 
     should clearly describe the problem that has been 
     tackled, the state of the art with respect to the 
     problem, the solution that is suggested and the 
     potential -- or even better the evaluated -- benefits 
     of the contribution. 
     We also call for short research papers, which are 
     intended to report ideas in their early stages,
     and are not required to show complete/evaluated result.

 (2) EXPERIENCE PAPERS describe the history of a 
     software product line accompanied by a critical review 
     of experience within one or more development phases 
     within family and/or application engineering. An 
     experience report describes lessons learned in domains
     of specific industries like automobile, mobile communication, 
     embedded controller, or enterprise SW 
     We also call for short experience papers: Short experience 
     papers are intended to report their useful and informative 
     experiences briefly, and highlight their main interesting 
     points.

 (3) POSTERS describes research result or on-going research
     projects. They are displayed in a dedicated poster area 
     at the conference, and presented in poster sessions.
     Poster papers will appear in a separate proceedings.

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 Review Process:

 At least three members of the SPLC 2007 program 
 committee will review each submission. The reviews 
 will be the basis for making final decisions about which 
 submissions to accept for presentation at the 
 conference. 
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 Accepted Submissions: 

  Each accepted paper submission will be allotted a maximum of 
  ten pages (full papers) or six pages (short papers) 
  in the conference proceedings. The final 
  version of accepted papers must conform to the 
  proceedings publication format. 
  Authors are required to present their work in a technical
  session.

  Each accepted poster submission will allotted two pages
  in the separate proceedings. Poster format will be 
  announced to accepted authors.
  Authors are required to present their work in poster
  sessions.

  PC members will vote for the best paper from full papers, 
  but no paper may be selected if there is no agreement on 
  the best paper.

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 Submission Guidelines:

 Papers should be submitted in PDF format. The results  
 described must be unpublished and should not be under  
 review elsewhere.  
 Submitted papers must conform to the IEEE proceeding
 8.5x11-inche, Two-Column Format (*), and should not exceed 
 ten pages (including all text, figures, references and 
 appendices). 

 (*) http://www.computer.org/portal/site/cscps/index.jsp
     INFORMATION FOR AUTHORS -> Formatting

 Short research/experience papers are also conform the 
 same format, and should not exceed six pages.
 
  Poster papers are also conform the same format, and
  should not exceed two pages.

 The submission deadline is firm! If you are unable to submit
 a paper electronically, please contact one of the two chairs
 at least two weeks prior to the submission deadline. 
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 Contact:

 For more information about submissions, feel free to 
 contact Tomoji Kishi (tkishi at jaist.ac.jp) and 
 Dirk Muthig (dirk.muthig at iese.fraunhofer.de). 
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 Organization: 

 GENERAL CHAIR
 Kyo Kang, POSTECH, Korea

 PROGRAM CHAIRS: 
 Tomoji Kishi, JAIST, Japan 
 Dirk Muthig, Fraunhofer IESE, Germany

 WORKSHOP CHAIR
 Peter Knauber, Mannheim University of Applied Science, Germany  

 TUTORIAL CHAIR
 Charles Krueger, BigLever Software Inc., USA

 PANEL CHAIR
 Jim Dager, Cummins Inc., USA 

 DEMONSTRATION CHAIR
 Stan Jarzabek, National University of Singapore, Singapore

 DOCTORIAL SYMPOSIUM CHAIR
 Jaejoon Lee, IESE, Fraunhofer, Germany 

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 PROGRAM COMMITTEE:

 Gary Chastek, SEI, USA
 Paul Clements, SEI,USA
 Sholom Cohen, SEI, USA
 Krysztof Czarnecki, University of Waterloo, Canada
 Stefania Gnesi, ISTI-CNR, Italy
 Hassan Gomaa, George Mason University, USA
 Masayuki Hirayama, IPA/SEC, Japan
 Stan Jarzabek, National University of Singapore, Singapore
 Jean-Marc Jezequel, IRSIA, France
 Isabel John, Fraunhofer IESE, Germany
 Michael Kircher, Siemens, Germany
 Charles W. Krueger, Biglever, USA
 Kwanwoo Lee, Hansung University, South Korea
 John D. McGregor, Clemson University, USA
 Natsuko, Noda, NEC Corp. / JAIST, Japan
 Sooyong Park, SOGANG University, South Korea
 Klaus Pohl, University of Limerick, Ireland and
             SSE, University of Duisburg-Essen, Germany
 Klaus Schmid, University of Hildesheim, Germany
 Andre van der Hoek, University of California, USA
 Frank van der Linden, Philips, The Netherlands
 Rob van Ommering, Philips, The Netherlands
 Karl Reed, La Trobe University, Australia
 Martin Verlage, Vereinigte Wirtschaftsdienste, Germany
 David M. Weiss, Avaya, USA
 Kentaro Yoshimura, Hitachi Europe, France

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