[ecoop-info] Reminder: COMPSAC 2007 paper submission deadline (January, 31, 2007) is approaching
Huang Gang
huanggang at sei.pku.edu.cn
Mon Jan 22 08:58:49 CET 2007
This is just a reminder that COMPSAC 2007 paper submission deadline (January, 31, 2007) is approaching.
Please note that authors missing the abstract submission deadline still can submit their papers.
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CALL FOR PAPERS
The 31st Annual International Computer Software and Applications Conference
(COMPSAC 2007)
Beijing, China, July 24 - 27, 2007
Sponsored by the IEEE Computer Society
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COMPSAC is a major international forum for researchers, practitioners, managers, and policy makers
interested in computer software and applications. It was first held in Chicago in 1977, and since
then it has been one of the major forums for academia, industry, and government to discuss the state
of art, new advances, and future trends in software technologies and practices. The technical program
includes keynote addresses, research papers, industrial case studies, panel discussions and fast
abstracts. It also includes a number of workshops on emerging important topics.
It should be noted that all IEEE COMPSAC conference proceedings are published by IEEE Computer Society
Conference Publishing Services (CPS). All CPS Publications are captured in the online IEEE Digital Library, and
professionally indexed through INSPEC and EI Index (Elsevier's Engineering Information Index).
The creation of trustworthy and dependable software spans all aspects of software engineering.
COMPSAC is a unique forum to bring together these facets and their major stakeholders. Building on
the trustworthy, secure, and dependable software themes of highly successful recent COMPSAC
conferences, the technical theme for the 31st conference is
SOFTWARE ENGINEERING -- CRITICAL FEATURES and INFRASTRUCTURES
The program of COMPSAC 2007 will continue to feature research and industrial practice papers with a
wide range of topics, focusing on the software engineering of critical infrastructure systems such
as, but not limited to, civil, telecommunications, and medical systems. To properly engineer such
systems, the foundations, methodologies, and mechanisms that support the design, modelling, and
evaluation of software systems must come from diverse sources. Topics of interest include requirement
analysis, co-analysis and co-design, modelling, design, development, testing, measurement, verification
and validation for performance, safety, security, and dependability constraints. Effective construction
of these systems is not limited solely to the field of computer science and engineering and is truly a
multidisciplinary effort. Multidisciplinary work, research and development software prototypes, industry
-university collaborations, all based on new emerging and critical technologies will be of particular
interest to this conference. All accepted papers will be published in the conference proceedings in
hardcopy and on-line version by the IEEE Computer Society. Plans had been made to forward select papers
to archival journals for publications.
Authors are invited to submit original, unpublished research papers as well as industrial practice
papers. Detailed instructions for electronic paper submission, panel and workshop proposals, tutorial
proposals, doctoral symposium and review process can be found at http://www.compsac.org/. The length of
the camera-ready of an accepted full paper and short paper will be limited to 8 and 4 (IEEE Proceedings
style) pages, respectively, and printed on 10-12 point fonts. Please follow the IEEE Computer Society
Press Proceedings Author Guidelines to prepare your papers. At least one author of each accepted paper
is required to pay full registration fee to the conference. Each accepted paper must be presented in
person by the author or one of the authors. One Best Paper award and 1-3 Best Student Paper Awards will
be presented by COMPSAC 2007. The first author of the best student papers must be full-time students.
IMPORTANT DATES
December 8, 2006: Workshop Proposals due
January 15, 2007: Abstract due
January 31, 2007: Full Paper and Short Paper due
March 30, 2007: Decision Notification (electronic)
April 30, 2007: Camera-Ready copy and Pre-registration due
SUBMISSION
Upload regular papers and fast abstracts in PDF, Postscript or RTF format at
http://www.compsac.org/
Submit panel proposals in plain text via email to
compsac2007 at compsac.org
Submit workshop in plain text via e-mail to
atilla.elci at emu.edu.tr
Information on accepted workshops and the submissions of workshop papers will be available at the
conference website
http://www.compsac.org/
GENERAL INQUIRIES
For more detailed and updated information, please refer to:
http://www.compsac.org/
For further information, please contact:
Carl Chang, Chair, Standing Committee, at chang at iastate.edu
OTHER PROGRAM DEVELOPMENT INQUIRIES
Program Co-Chairs: Fevzi Belli, University of Paderborn, Germany at Fevzi.Belli at adt.upb.de
Bruce McMillin, University of Missouri, Rolla, USA at ff at umr.edu
Hong Mei, Peking University, China at meih at pku.edu.cn
CONFERENCE ORGANIZERS
STEERING COMMIITTEE
Carl K. Chang (Chair), Iowa State University, USA
Aditya Mathur, Purdue University, USA
Dick Simmons, Texas A&M University, USA
T. H. Tse, University of Hong Kong, Hong Kong
Eric Wong, University of Texas at Dallas, USA
Johnny Wong, Iowa State University, USA
Stephen S. Yau, Arizona State University, USA
General Co-Chairs
Anson Chen, Motorola Inc., USA
Huimin Lin, Chinese Academy of Sciences, China
Program Co-Chairs
Fevzi Belli, University of Paderborn, Germany
Bruce McMillin, University of Missouri, Rolla, USA
Hong Mei, Peking University, China
Requirements Track Co-Chairs
Dave Card, Q-Labs, France
Tiberiu Seceleanu, University of Turku, Finland
Quality Track Co-Chairs
Warren Harrison, Portland State University, USA
Ji Wang, Changsha Institute of Technology, China
Maintenance and System Life Cycle Co-Chairs
Kai-Yuan Cai, Beijing University of Aeronautics and Astronautics, China
Rajesh Subramanyan, Siemens Corporate Research, USA
Industry Track Co-Chairs
Stephen Chen, Motorola, Inc., USA
Hui Su, IBM Research, China
Ina Schieferdecker, Fraunhofer FOKUS, Germany
Industrial Panels Chair
Edward Zou, Motorola Global Software Group, China
Education Track Co-Chairs
Pradip Srimani, Clemson University, USA
Baowen Xu, Southeast University, China
Tutorial Co-Chairs
Sami Beydeda, The Federal Finance Office, Germany
Chunxiao Xing, Tsinghua University
Workshop Chair
Atilla Elci, Eastern Mediterranean University, North Cyprus
Doctoral Symposium Chair
Sahra Sedigh-Ali, University of Missouri, Rolla, USA
Proceedings Chair
Tien Nguyen, Iowa State University, USA
Finance Chair
Simanta Mitra, Iowa State University, USA
Publicity Chairs
Huang Gang, Peking University, China
Ville Leppanen, University of Turku, Finland
Frank Liu, University of Missouri, Rolla, USA
Local Arrangements Chair
Qianxiang Wang, Peking University, China
Registration Chairs
Donggang Cao, Peking University, China
Hsinyi Jiang, Iowa State University, USA
Web Chair
Jinchun Xia, Iowa State University, USA
Program Committee:
Hiralal Agrawal, Telcordia Technologies, USA
Sheikh Ahamed, Marquette University, USA
Mikio Aoyama, Nanzan University, Japan
Doo-Hwan Bae, KAIST, Korea
Maarten Boasson, University of Amsterdam, Netherlands
Joao W. Cangussu, University of Texas at Dallas,USA
Young-Fu Chang, Lucent Technologies, USA
T.Y. Chen, Swinburne University of Technology, Australia
Y. C. Chen, National Chiao Tung University, Taiwan
Shing-Chi Cheung, Hong Kong University of Sci. and Tech., Hong Kong
William Chu, Tunghai University, Taiwan
James Cross, Auburn University, USA
Alan Davis, University of Colorado at Colorado Springs, USA
Tharam Dillon, University of Technology Sydney, Australia
Hiroshi Esaki, University of Tokyo,Japan
Vladimir Getov,University of Westminster, UK
Chris Gill, Washington Unviersity, St. Louis, USA
Pankaj Jalote, IIT Kanpur, India
Ahmed Amine Jerraya, TIMA Laboratory, France
T. Ming Jiang, National Chung Cheng University, Taiwan
Karama Kanoun, LAAS-CNRS, France
Seong W. Kim, Samsung Advanced Institute of Technology, Korea
Dave Kung, University of Texas at Arlington, USA
Jenny Li, Avaya Labs, USA
Lin Liu, Tsinghua University, China
Jian Lu, Nanjing University, China
Doug Niehaus, University of Kansas, USA
Lionel Ni, Hong Kong University of Science and Technology,HongKong
Cristina Cerschi Seceleanu, Abo Akademi University, Finland
Michiharu Takemoto, NTT Labs, Japan
Feng-Jian Wang, National Chiao-Tung University, Taiwan
Fei Xie, Portland State University, USA
Dianxiang Xu, North Dakota State University, USA
Hongji Yang, De Montford University, UK
Y. T. Yu, City University of Hong Kong, Hong Kong
Jian Zhang, Chinese Academy of Sciences, China
Hong Zhu,Oxford Brookes University, UK
Mohammad Zulkernine Queen's University, Canada
(more program committee members to be added)
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